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TIA collaborative research program "Kakehashi"

TIA has launched a program called Kakehashi (meaning "linking bridge" ), a collaborative framework for researchers among the five core organizations to explore research themes with the potential to spark innovation. This program facilitates the process involving the selection of many challenging research projects, collaboration of researchers from different organizations for each project, and formulation of strategies and establishment of a system to move the new project forward.

In FY2016, 39 research projects were conducted. They cover various research fields, including nano-biotechnology, computational materials science, big data analysis.
In FY2017, 50 projects are selected.

Kakehashi projects in FY2016

Listed below are the major 5 projects out of the total 39 ones. The posters are mostly in Japanese.

Study on IoT devices for logistics

Technical problems and applications of IoT terminals are investigated that measure the position and vibration of logistics equipment (? transport vehicle ?). Leading companies in this field are invited to hold a workshop.

Diamond electronic device realization

Diamond semiconductor has superior and unique properties. Using these properties, new electronic devices with superior characteristics and unique functions have been developed. For commercialization of new diamond electronic devices, we have been discussing the research themes and collaboration.

Study for obtaining high quality TMDC crystals

Among 2D materials such as graphene, improvement for the semiconducting properties of transition metal dichalcogenides (TMDC) is an important subject for their device application. In this study, high pressure melt growth technique is applied for obtaining high quality TMDC crystals with suppression of vaporization of volatile components.

Coherent Raman imaging of brown adipocytes

We have applied coherent anti-Stokes Raman scattering (CARS) imaging to brown adipocytes in order to investigate the intracellular lipid distribution and its composition.

Research Study of 3D integration semiconductor quantum image sensor

We study and research innovative, high quality and high sensitivity image sensor combining 3D integration technique of AIST, quantum sensor technologies of KEK and Univ. of Tsukuba, and IC design technologies of The University of Tokyo.